In-Line with Fi-Tech – Spring 2025
Welcome to the spring 2025 issue of In-Line with Fi-Tech. We would like to welcome the newest member of the Fi-Tech Sales Team, Joe Bernard. With a degree in Textile Technology from NC State, Joe comes to us with extensive manufacturing experience in Textiles and Technical Textiles. More recently, Joe has taken his industry knowledge to the product and machinery side where he developed strong market and customer development skills in his previous role. Welcome to the Fi-Tech
Team, Joe!
In this issue of In-Line with Fi-Tech, would like to highlight two important Exhibitions in which Fi-Tech will be participating. First, the Fi-Tech sales team will be in Miami Beach for the IDEA Show, April 29 – May 1. The IDEA Show brings together the entire supply chain for the Nonwovens Industry including durable and non-durable markets like Hygiene, Wipes, Filtration, Auto, and Geotextiles. Our Booth Number is 4301 and we will have on our booth representatives from Asten Johnson, Spoolex, Saueressig, Schill+Seilacher, and Tokuden. Reifenhauser Reicofil and Enka Tecnica will be located in the booth next to us (Booth #4001).
The following week, May 6-8, Fi-Tech will have a booth at the Techtextil North America Show in Atlanta. This show covers the Textiles, Technical Textiles and Fibers markets. We will be located at Booth #3207 and will have representatives on our booth from Brückner, Benninger, Zimmer-Austria, Baldwin, Ontec, Heberlein and Schill+Seilacher. In addition to these shows, Fi-Tech will be participating in the WOW Conference for the Wipes Industry in Columbus, OH, July 21-24.
Also, in this edition of our newsletter, Fi-Tech presents some product updates from our suppliers TEMCO, Hansa, Baldwin and Shelton Vision. Have a safe and productive spring and we look forward to seeing you at one of these shows or conferences. As always, you can find more details on Fi-Tech and our principals at www.fi-tech.com.
Todd L. Bassett
Managing Director
Read Full Newsletter: Fi-Tech Spring 2025 Newsletter
